Reuters reported that two Chinese chipmakers plan to introduce high bandwidth memory (HBM). Reportedly, they are in the early stages of producing HBM semiconductors which are usually used in artificial intelligence chipset.
The progress in HBM – even if only in older versions of HBM – represents a major step forward in China’s efforts to reduce its reliance on foreign suppliers amid tensions with Washington that have led to restrictions on U.S. exports of advanced chipsets to Chinese firms.
What’s the new plan?
CXMT, China’s top manufacturer of DRAM chips, has developed sample HBM chips in partnership with chip packaging and testing company Tongfu Microelectronics (002156.SZ), opens new tab, according to three people briefed on the matter. The chips are being shown to clients, two of them said.
In another example, Wuhan Xinxin seems to be building a factory that will be able to produce 3,000 12-inch HBM wafers a month. The construction is expected to start in February this year, as reported by corporate database Qichacha show.
Plans ahead!
Reportedly, CXMT and other Chinese chip firms have also been holding regular meetings with South Korean and Japanese semiconductor equipment firms to buy tools to develop HBM, said two of the people.
“The sources were not authorised to speak on the matter and declined to be identified. Hefei-based CXMT or ChangXin Memory Technologies and Tongfu Microelectronics did not respond to requests for comment,” Reuters concluded.
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