Google Pixel phones have been packing Tensor chipsets since 2021. The first-gen Tensor chip debuted on the Pixel 6 and Pixel 6 Pro, which were officially announced in October 2021.
Since its debut, the Tensor chipsets have come a long way and improved significantly. With the surge in popularity and sales of Pixel handsets, some reports indicated that Google may be planning on producing a fully customized chip for its Pixel 2024 line and starting a contract with TSMC, a major semiconductor foundry.
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However, a new report by SamMobile indicates that it’s not going to happen and once again, Samsung will be helping California’s tech giant produce Tensor chipsets using a 4nm process.
Samsung Foundry has been reportedly awarded a contract to manufacture the Tensor G4 processor for Google’s next Pixel phones, the Pixel 9, Pixel 9 Pro, and Pixel Fold 3. The Tensor G4 will be produced using Samsung’s third-generation 4nm process, which offers better performance and efficiency than the second-generation 4nm process used for the Tensor G3. Samsung’s in-house Exynos 2200 processor used the first-generation 4nm process, and the upcoming Exynos 2400 processor will also use the third-generation 4nm process.
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Whether Google will be able to succeed with its plans of producing a fully customised Tensor chip, in partnership with TSMC, is put on halt for this year, at least. Google may likely launch its fully customised Tensor chip in the coming years, say 2025 or 2026.
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