Tessolve, a Hero Electronix venture, has collaborated with NXP Semiconductors to advance the productisation of a mass-market digital connected cluster reference design based on NXP’s i.MX RT1170 crossover MCU, AW611 Wi-Fi/Bluetooth combo chip, KW45 Bluetooth LE smart access MCU and PF5103 multi-channel PMIC.
The collaboration aims to deliver an industry-leading solution to OEMs, offering sophistication and ease of integration into vehicles with minimal customisation requirements. By offering this product solution, Tessolve says it will significantly streamline the evaluation, development, and deployment processes for OEMs seeking to integrate cutting-edge digital cluster solutions into their vehicles. This synergy ultimately reduces complexity, costs, and time-to-market for OEMs.
Tessolve’s Digital Connected Cluster, powered by the NXP i.MX RT1170-based SMARC SoM, is tailored for the two-wheeler and three-wheeler market and boasts automotive compliance. It features a 5-inch display (upgradeable to 7-inch), NXP chipsets for BLE and Wi-Fi 6 connectivity, multi-channel power management, and CAN interface, this complete solution is production-ready and primed for deployment.
Dan Loop, VP and General Manager, Automotive Edge Product Lines, NXP said, “High-resolution digital displays play a pivotal role in ensuring the safe operation of electric vehicles (EVs) with limited range. They furnish drivers with indispensable information, including battery status updates, navigation guidance, and the whereabouts of nearby charging stations.”
“The NXP solution delivers advanced graphics along with smartphone connectivity to enable a rich user experience in a very cost-effective system solution. The production ready DCC platform now makes it that much easier for customers to get their products to market quickly,” added Loop.
Kiran Kumar Nagendra, AVP – Embedded Systems, Tessolve said, “Our NXP i.MX RT1170-based cluster with advanced performance graphics and rich wireless and audio connectivity delivers a digital driving experience which takes us into the future of two-wheeler mobility. Built using Tessolve’s 3-D product engineering principle, which stands for, development platform, deployable system, or derivative solution, our cluster can be adopted by OEMs either “as is” or can be customised for their needs. Tessolve accelerates OEMs’ time to market with exceptional ODM abilities, offering digital cluster white labelling as well.”
