As smartphones become increasingly powerful and compact, they are more prone to overheating. While there are various cooling methods available for smartphones, the latest innovation from a California-based company introduces the tiniest cooling solution yet. The newly launched XMC-2400 chip is the smallest ever chip designed to efficiently manage processor temperatures.
xMEMS Labs, a pioneer in microelectromechanical systems (MEMS) technology, has unveiled the world’s thinnest active micro-cooling device. Dubbed the “Fan on a chip”, this tiny device measures 1mm in thickness and offers a compact solution for thermal management in phones and tablets.
The XMC-2400 chip utilises MEMS technology to create a miniature fan that operates at high frequencies, generating a strong airflow to dissipate heat. Its compact design and low power consumption make it ideal for use in devices where space is limited and energy efficiency is critical such as smartphones and tablets.
The XMC-2400 chip, measures 9.26 x 7.6 x 1.08 millimeters and weighs under 150 milligrams. It is about 96 percent smaller and lighter than traditional non-silicon-based active cooling solutions. Despite its size, this chip can move up to 39 cubic centimeters of air per second while handling 1,000Pa of back pressure.
“With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology,” said the company at the launch.
Compared to traditional phone processor cooling solutions, the XMC-2400 chip represents a major advancement in compact cooling technology. Traditional methods, such as heat pipes, thermal pads, and metal heat sinks, often require considerable space and add bulk to devices. In contrast, the XMC-2400 is very thin and lightweight offering a significant reduction in size and weight.
