Toshiba Develops World’s First 16-die Stacked NAND Flash Memory with TSV Technology

By: | Published: August 7, 2015 4:15 AM

Toshiba Corporation today announced the development of the world’s first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

Toshiba Corporation (TOKYO:6502) today announced the development of the world’s first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA.

 

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16-die Stacked NAND Flash Memory with TSV Technology (Photo: Business Wire)16-die Stacked NAND Flash Memory with TSV Technology (Photo: Business Wire)

The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for the connection. This enables high speed data input and output, and reduces power consumption.

 

Toshiba’s TSV technology achieves an I/O data rate of over 1Gbps which is higher than any other NAND flash memories with a low voltage supply: 1.8V to the core circuits and 1.2V to the I/O circuits and approximately 50%*2 power reduction of write operations, read operations, and I/O data transfers.

 

This new NAND flash memory provides the ideal solution for low latency, high bandwidth and high IOPS/Watt in flash storage applications, including high-end enterprise SSD.

 

A part of this applied technology was developed by the New Energy and Industrial Technology Development Organization (NEDO).

 

The General Specification of Prototype
Package TypeNAND Dual x8 BGA-152
Storage Capacity (GB)128256
Number of Stacks816
External Dimension

(mm)

W 14 14

D 18 18 H 1.35 1.90Interface Toggle DDR

Note:
*1: As of August 6, 2015. Toshiba survey.
*2: Compared with Toshiba’s current products.

 

About Toshiba

 

Toshiba Corporation, a Fortune Global 500 company, channels world-class capabilities in advanced electronic and electrical product and systems into five strategic business domains: Energy & Infrastructure, Community Solutions, Healthcare Systems & Services, Electronic Devices & Components, and Lifestyles Products & Services. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations towards securing “Growth Through Creativity and Innovation”, and is contributing to the achievement of a world in which people everywhere live safe, secure and comfortable society.

 

Founded in Tokyo in 1875, today’s Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide, with annual sales surpassing 6.5 trillion yen (US$63 billion).
To find out more about Toshiba, visit www.toshiba.co.jp/index.htm

 

 

 

 

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