LeEco has launched the Le Pro 3, its new flagship ‘superphone’ on Thursday and the handset becomes, according to what the company says, the world’s first device to pack a Qualcomm Snapdragon 821 chipset. However, don’t expect to get your hands on the phone any time soon as it is at the pre-order stage. Its availability in China will be from September 28.
The Qualcomm Snapdragon 821 chipset on the Le Pro 3 superphone reportedly works 10 per cent faster the previous one. Le Pro 3 comes in variants: 4GB+32GB, 6GB+64GB, 4GB+64GB and 6GB+128GB.
Feng Xin, Senior Vice President of Le Holdings and CEO of LeMobile, said in a statement, “LeEco ‘superphones’ have already been launched in overseas markets such as India, Hong Kong and Russia. The total sales have crossed 17 million units globally and we are looking forward to bring more disruptive products in the near future.”
Le Pro 3 smartphone is a dual-SIM device with a 5.5-inch full-HD all-metal unibody and sports a 4,070 mAh battery comes. The smartphone also has 16MP rear camera and an 8MP front shooter. According to the company, the Le Pro3 camera starts up in only 0.6 seconds and adjusts to surroundings in 30 seconds.